JPH085003Y2 - ワイヤーソー - Google Patents
ワイヤーソーInfo
- Publication number
- JPH085003Y2 JPH085003Y2 JP4172990U JP4172990U JPH085003Y2 JP H085003 Y2 JPH085003 Y2 JP H085003Y2 JP 4172990 U JP4172990 U JP 4172990U JP 4172990 U JP4172990 U JP 4172990U JP H085003 Y2 JPH085003 Y2 JP H085003Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire saw
- wire
- covering member
- grinding
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002245 particle Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000004575 stone Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4172990U JPH085003Y2 (ja) | 1990-04-18 | 1990-04-18 | ワイヤーソー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4172990U JPH085003Y2 (ja) | 1990-04-18 | 1990-04-18 | ワイヤーソー |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH042519U JPH042519U (en]) | 1992-01-10 |
| JPH085003Y2 true JPH085003Y2 (ja) | 1996-02-14 |
Family
ID=31552649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4172990U Expired - Lifetime JPH085003Y2 (ja) | 1990-04-18 | 1990-04-18 | ワイヤーソー |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085003Y2 (en]) |
-
1990
- 1990-04-18 JP JP4172990U patent/JPH085003Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH042519U (en]) | 1992-01-10 |
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